Good cleaning effect, high cleanliness, and consistent cleanliness of all workpieces. Fast cleaning speed, improved production efficiency, no need for manual contact with cleaning solution, safe and reliable. Deep holes, fine seams, and concealed parts of workpieces can also be cleaned thoroughly. No damage to the surface of the workpiece, saving solvents, heat energy, workspace, and labor.
Ultrasonic cleaning methods exceed conventional cleaning methods, especially for complex surfaces of workpieces, such as mechanical parts with uneven surfaces and blind holes, as well as small products that require high cleanliness, such as clock and precision machinery parts, electronic components, circuit board components, etc. Ultrasonic cleaning can achieve ideal results.
The mechanism of ultrasonic cleaning mainly includes the following aspects: due to the strong shock wave generated when cavitation bubbles burst, a part of the dirt layer is peeled off, dispersed, emulsified, and peeled off under the action of the shock wave.
The bubbles generated by cavitation penetrate through the gaps and voids between the dirt layer and the surface layer formed by impact. Due to the synchronous expansion and contraction of these small bubbles and sound pressure, a physical force like peeling repeatedly acts on the dirt layer, and the dirt layer is peeled off layer by layer. The bubbles continue to penetrate inward until the dirt layer is completely peeled off. This is the cavitation secondary effect. The impact of ultrasonic vibration of cleaning solution on dirt in ultrasonic cleaning. Ultrasound accelerates the dissolution process of dirt by chemical cleaning agents, combining chemical and physical forces to accelerate the cleaning process.
